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BD8119FM-M
● Power Dissipation Calculation
Power dissipation can be calculated as follows:
Pc(N) = ICC*VCC + 2*Ciss*VREG*Fsw*Vcc+[VLED*N+ △ Vf*(N-1)]*ILED
Technical Note
I CC
V CC
C iss
V sw
F sw
V LED
N
Δ V f
I LED
Maximum circuit current
Supply power voltage
External FET capacitance
SW gate voltage
SE frequency
LED control voltage
LED parallel numeral
LED V f fluctuation
LED output current
Sample Calculation:
Pc(4) = 10mA × 30V + 500pF × 5V × 300kHz × 30V + [1.0V × 4 + Vf × 3] × 100mA
Vf = 3.0V, Pc (4) = 322.5mW + 1.3W = 1622.5mW
Power Dissipation
2500
4
(3) 3.50W
(1) θja=56.8℃/W (Substrate copper foil density 3%)
(2) θja=39.1℃/W (Substrate copper foil density34%)
(3) θja=35.7℃/W (Substrate copper foil density60%)
2000
1500
ILED=5
0mA
3
(2) 3.20W
(1) 2.20W
1000
500
0
ILED=1
00mA
ILED=1
50mA
2
1
0
0.5
1 1.5 2 2.5
Fluctuation Δ
LED LEDバラツキ⊿Vf[V] [V]
3
3.5
0
25
50 75 95 100
Ambient Temperature Ta[℃]
125
150
Fig.16
Note 1: Power dissipation calculated when mounted on 70mm X 70mm X 1.6mm glass epoxy substrate (1-layer platform/copper thickness 18μm)
Note 2: Power dissipation changes with the copper foil density of the board.
The area of the copper foil becomes the total area of the heat radiation fin and the foot pattern (connected directly with IC) of this IC.
This value represents only observed values, not guaranteed values.
Pd=2200mW ( 968mW): Substrate copper foil density 3%
Pd=3200mW (1408mW): Substrate copper foil density 34%
Pd=3500mW (1540mW): Substrate copper foil density 60% (Value within parentheses represents power dissipation when Ta=95°C)
Note 3: Please design so that ambient temperature + self-generation of heat may become 150 ℃ or less because this IC is Tj=150 ℃ .
Note 4: Please note the heat design because there is a possibility that thermal resistance rises from the examination result of the temperature cycle
by 20% or less.
www.rohm.com
? 2011 ROHM Co., Ltd. All rights reserved.
15/20
2011.08 - Rev.B
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